Sequential Event Modeling and Reliability Analysis using the Erlang Continuous Distribution
βοΈ Authors
Ahmed Shukur Corresponding
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π Abstract
The Erlang Continuous Distribution, a subset of the Gamma Distribution with an integer shape parameter, is a powerful tool for modeling sequential events and waiting times in various fields such as reliability engineering, telecommunications, and operations management. Its unique structure allows it to accurately represent the cumulative probability of events that must pass through multiple stages before completion. This proposal aims to leverage the Erlang Continuous Distribution to model complex processes with sequential stages, such as system reliability, queue wait times, and maintenance intervals in machinery.\r\nThe study includes five numerical examples to highlight the Erlang Continuous Distribution\'s utility in real-world applications: predicting hardware failure in staged degradation processes, optimizing wait times in service queues, estimating call duration in telecommunications, assessing healthcare system patient flow, and determining optimal maintenance schedules. These examples demonstrate the distributionβs flexibility and effectiveness in capturing time-dependent processes across various disciplines.\r\nThrough parameter estimation using Maximum Likelihood Estimation (MLE) and Bayesian methods, followed by validation via goodness-of-fit tests, the study examines the distribution\'s predictive accuracy in representing time-to-event data. Results indicate that the Erlang Continuous Distribution outperforms simpler exponential models in scenarios with staged processes, yielding better predictions and supporting resource optimization. By providing insights into sequential processes, this study illustrates the Erlang Continuous Distribution\'s practical benefits in performance and reliability analysis across different sectors. \r\n
Ahmed Shukur . (2023). Sequential Event Modeling and Reliability Analysis using the Erlang Continuous Distribution. Journal of Positive Sciences (JPS), 3(5), 75 - 81. https://doi.org/10.52688/259jps/ASP85431